Apparatus for providing an aligned coil for an inductive head structure using a patterned seed layer

ABSTRACT

An apparatus for providing an aligned coil for an inductive head structure using a patterned seed layer is disclosed. The present invention uses an aligned process where the base plate imprint is fabricated on an electrically insulating layer and the reversed image is fabricated and etched into the coil insulation material, e.g., hard bake photoresist to alleviate the problems associated with complete ion removal of the seed layer between high aspect ratio coils. The present invention would also not be prone to plating non-uniformities (voids), and would not be subject to seed layer undercutting in a wet etch step process.

RELATED PATENT DOCUMENTS

This is a divisional of patent application Ser. No. 10/101,196, filedMar. 18, 2002 (SJO920010045US1), to which Applicant claims priorityunder 35 U.S.C. §120.

BACKGROUND OF THE INVENTION

1. Field of the Invention

This invention relates in general to magnetic transducers, and moreparticularly to an apparatus for providing an aligned coil for aninductive head structure using a patterned seed layer.

2. Description of Related Art

Magnetic recording is a key and invaluable segment of theinformation-processing industry. While the basic principles are onehundred years old for early tape devices, and over forty years old formagnetic hard disk drives, an influx of technical innovations continuesto extend the storage capacity and performance of magnetic recordingproducts. For hard disk drives, the areal density or density of writtendata bits on the magnetic medium has increased by a factor of more thantwo million since the first disk drive was applied to data storage.Since 1991, areal density has grown by the well-known 60% compoundgrowth rate, and this is based on corresponding improvements in heads,media, drive electronics, and mechanics.

Magnetic recording heads have been considered the most significantfactor in areal-density growth. The ability of these components to bothwrite and subsequently read magnetically recorded data from the mediumat data densities well into the Gbits/in² range gives hard disk drivesthe power to remain the dominant storage device for many years to come.

The heart of a computer is an assembly that is referred to as a magneticdisk drive. The disk drive includes a rotating magnetic disk, write andread heads that are suspended by a suspension arm above the rotatingdisk and an actuator that swings the suspension arm to place the readand write heads over selected circular tracks on the rotating disk. Theread and write heads are directly mounted on a slider that has an airbearing surface (ABS). The suspension arm biases the slider into contactwith the surface of the disk when the disk is not rotating. However,when the disk rotates, air is compressed by the rotating disk adjacentthe ABS causing the slider to ride on an air bearing a slight distancefrom the surface of the rotating disk. The write and read heads areemployed for writing magnetic impressions to and reading magneticimpressions from the rotating disk. The read and write heads areconnected to processing circuitry that operates according to a computerprogram to implement the writing and reading functions.

Prior to 1991, heads were designed with a single inductive sensorperforming both reading and writing functions. The decreasing signalamplitude resulting from areal densities exceeding 500 Mbits/in²promoted the development of magnetoresistive and giant-magnetoresistiveread sensors merged with an inductive head, which now performed a writefunction only. While write track widths can be wider than thecorresponding read widths, i.e. “write wide and read narrow”, inductivesensors must be redesigned with narrower gaps and pole geometries. Atthese higher data densities, pole edge effects become more significant.Coil widths and numbers of turns, all attained by advancedphotolithographic techniques over large topographies, must be optimizedto achieve adequate inductance focused within a very small writing areaon the medium. Finally, it is a consequence of increased areal densitythat the media or internal data rate, i.e. the rate at which informationis written and read within a disk drive, is increased.

A write head includes a coil layer embedded in first, second and thirdinsulation layers (insulation stack), the insulation stack beingsandwiched between first and second pole piece layers. A write gap layerbetween the first and second pole piece layers forms a magnetic gap atan air bearing surface (ABS) of the write head. The pole piece layersare connected at a backgap. Current conducted to the coil layer inducesa magnetic field across the magnetic gap between the pole pieces. Thisfield fringes across the magnetic gap for the purpose of writinginformation in tracks on moving media, such as the circular tracks onthe aforementioned rotating disk or a linearly moving magnetic tape in atape drive.

The read head includes first and second shield layers, first and secondgap layers, a read sensor and first and second lead layers that areconnected to the read sensor for conducting a sense current through theread sensor. The first and second gap layers are located between thefirst and second shield layers and the read sensor and the first andsecond lead layers are located between the first and second gap layers.The distance between the first and second shield layers determines thelinear read density of the read head. The read sensor has first andsecond side edges that define a track width of the read head. Theproduct of the linear density and the track density equals the arealdensity of the read head which is the bit reading capability of the readhead per square inch of the magnetic media.

As mentioned above, a significant factor in achieving gigabyte densitiesin computers has been increasing the track density of the write head.Track density is expressed in the art as tracks per inch (TPI) which isthe number of tracks that the write head can write per inch of width ofa rotating disk or linearly moving magnetic tape.

The coil inductance per square turn can be reduced by decreasing thecoil diameter, requiring a smaller coil pitch. However, currentprocessing of electroplating the coil limits the coil pitch. The primaryfailure mode is inter-coil turn shorting to each other. Themagnetic-circuit part of the inductance is dominated by the flux whichfringes between the two poles and is reduced by decreasing the volume ofdriven magnetic material and also by increasing the separation of thetwo poles. But an adequate cross-section of the poles must be maintainedto prevent saturation. Therefore, the easiest way to speed up a writehead is to reduce the yoke length. The use of two or more coil layersfacilitates these geometry changes at the expense of process complexity.If magnetic recording is to continue increasing in areal density morerapidly than semiconductor devices, a point will be reached where thelithographic resolution demands for critical dimensions of heads willexceed the capability of the conventional tooling available.

It can be seen that there is a need for an apparatus that providesnarrower write coils to allow reduced yoke lengths and therefore greaterareal densities.

SUMMARY OF THE INVENTION

To overcome the limitations in the prior art described above, and toovercome other limitations that will become apparent upon reading andunderstanding the present specification, the present invention disclosesan apparatus for providing an aligned coil for an inductive headstructure using a patterned seed layer.

The present invention solves the above-described problems by using analigned process where the base plate imprint is fabricated on anelectrically insulating layer and the reversed image is fabricated andetched into the coil insulation material, e.g., hard bake photoresist toalleviate the problems associated with complete ion removal of the seedlayer between high aspect ratio coils. The present invention would alsonot be prone to plating non-uniformities (voids), and would not besubject to seed layer undercutting in a wet etch step process.

In another embodiment of the present invention, an inductive head isdescribed. The inductive head includes an insulation layer provided overa magnetic material, a pre-patterned seed layer deposited over theinsulation layer, a hard bake resist layer formed to overlay the seedlayer and the insulation layer, wherein the hard bake resist layer toform trenches and an electroplatable metal formed in the trenches toestablish a coil, wherein the electroplatable metal is aligned with theseed layer via the trenches.

In another embodiment of the present invention, a magnetic storagedevice is described. The magnetic storage device head includes magneticmedia for storing data thereon, a motor for translating the position ofthe magnetic media, an actuator for positioning a magnetic head relativeto the magnetic media, the magnetic head including an inductive headformed using an aligned coil for an inductive head structure, theinductive head further comprising an insulation layer provided over amagnetic material, a pre-patterned seed layer deposited over theinsulation layer, a hard bake resist layer formed to overlay the seedlayer and the insulation layer, wherein the hard bake resist layer toform trenches and an electroplatable metal formed in the trenches toestablish a coil, wherein the electroplatable metal is aligned with theseed layer via the trenches.

These and various other advantages and features of novelty whichcharacterize the invention are pointed out with particularity in theclaims annexed hereto and form a part hereof. However, for a betterunderstanding of the invention, its advantages, and the objects obtainedby its use, reference should be made to the drawings which form afurther part hereof, and to accompanying descriptive matter, in whichthere are illustrated and described specific examples of an apparatus inaccordance with the invention.

BRIEF DESCRIPTION OF THE DRAWINGS

Referring now to the drawings in which like reference numbers representcorresponding parts throughout:

FIG. 1 illustrates a storage system according to the present invention;

FIG. 2 illustrates one particular embodiment of a storage systemaccording to the present invention;

FIG. 3 illustrates a slider mounted on a suspension;

FIG. 4 is an ABS view of the slider and the magnetic head;

FIG. 5 is a side cross-sectional elevation view of a merged MR or spinvalve head which has a write head portion and a read head portion, theread head portion employing an MR or spin valve sensor;

FIG. 6 is a partial ABS view of the slider taken along plane 6-6 of FIG.5 to show the read and write elements of the prior art magnetic head;

FIG. 7 is a view taken along plane 7-7 of FIG. 5 with all material abovethe second pole piece removed;

FIGS. 8 a-8 i illustrate the process of forming an aligned coil for aninductive head structure using a patterned seed layer according to thepresent invention;

FIGS. 9 a-c show the details of the patterned seed layer;

FIG. 10 illustrates another embodiment according to the presentinvention wherein only the coil area is patterned and the remainingareas are full film;

FIG. 11 is a flow chart of a process to incorporate an aligned coilstructure with a coplanar pole piece according to the present invention;

FIG. 12 is a flow chart of a process to incorporate an aligned coilstructure with a coplanar pole piece according to the present invention;and

FIG. 13 is a flow chart of a process to incorporate an aligned coilstructure with a co-planar pole piece according to the presentinvention.

DETAILED DESCRIPTION OF THE INVENTION

In the following description of the exemplary embodiment, reference ismade to the accompanying drawings which form a part hereof, and in whichis shown by way of illustration the specific embodiment in which theinvention may be practiced. It is to be understood that otherembodiments may be utilized as structural changes may be made withoutdeparting from the scope of the present invention.

The present invention provides an apparatus for providing an alignedcoil for an inductive head structure using a patterned seed layer. Thepresent invention solves the above-described problems by using analigned process where the base plate imprint is fabricated on anelectrically insulating layer and the reversed image is fabricated andetched into the coil insulation material, e.g., hard bake photoresist toalleviate the problems associated with complete ion removal of the seedlayer between high aspect ratio coils. The present invention would alsonot be prone to plating non-uniformities (voids), and would not besubject to seed layer undercutting in a wet etch step process.

FIG. 1 illustrates a storage system 100 according to the presentinvention. In FIG. 1, a transducer 110 is under control of an actuator120. The actuator 120 controls the position of the transducer 110. Thetransducer 110 writes and reads data on magnetic media 130. Theread/write signals are passed to a data channel 140. A system processor150 controls the actuator 120 and processes the signals of the datachannel 140. In addition, a media translator 160 is controlled by asystem processor 150 to cause the magnetic media 130 to move relative tothe transducer 110. The present invention is not meant to be limited toa particular type of storage system 100 or to the type of media 130 usedin the storage system 100.

FIG. 2 illustrates one particular embodiment of a storage system 200according to the present invention. In FIG. 2, a hard disk drive 200 isshown. The drive 200 includes a spindle 210 that supports and rotates amagnetic disk 214. The spindle 210 is rotated by a motor 220 that iscontrolled by a motor controller 230. A combined read and write magnetichead 240 is mounted on a slider 242 that is supported by a suspension244 and actuator arm 246. Processing circuitry (not shown in FIG. 2, butrepresented by Signal Processing 150 in FIG. 1) exchanges signals,representing such information, with the head 240, provides motor drivesignals for rotating the magnetic disk 214, and provides control signalsfor moving the slider to various tracks. A plurality of disks 214,sliders 242 and suspensions 244 may be employed in a large capacitydirect access storage device (DASD).

The suspension 244 and actuator arm 246 position the slider 242 so thatthe magnetic head 240 is in a transducing relationship with a surface ofthe magnetic disk 214. When the disk 214 is rotated by the motor 220 theslider 240 is supported on a thin cushion of air (air bearing) betweenthe surface of the disk 214 and the air bearing surface (ABS) 248. Themagnetic head 240 may then be employed for writing information tomultiple circular tracks on the surface of the disk 214, as well as forreading information therefrom.

FIG. 3 illustrates a slider 310 mounted on a suspension 312. In FIG. 3first and second solder connections 304 and 306 connect leads from thesensor 308 to leads 313 and 314 on the suspension 312 and third andfourth solder connections 316 and 318 connect the coil 384 to leads 324and 326 on the suspension.

FIG. 4 is an ABS view of the slider 400 and the magnetic head 404. Theslider has a center rail 456 that supports the magnetic head 404, andside rails 458 and 460. The rails 456, 458 and 460 extend from a crossrail 462. With respect to rotation of a magnetic disk, the cross rail462 is at a leading edge 464 of the slider and the magnetic head 404 isat a trailing edge 466 of the slider.

FIG. 5 is a side cross-sectional elevation view of a merged MR or spinvalve head 500 which has a write head portion 510 and a read headportion 512, the read head portion employing an MR or spin valve sensor574. The head portion of the merged head includes a coil layer 584located between first and second insulation layers 586 and 588. A thirdinsulation layer 590 may be employed for planarizing the head toeliminate ripples in the second insulation layer caused by the coillayer 584. The first, second and third insulation layers are referred toin the art as an “insulation stack”. The coil layer 584 and the first,second and third insulation layers 586, 588 and 590 are located betweenfirst and second pole piece layers 592 and 594. The first and secondpole piece layers 592 and 594 are magnetically coupled at a backgap 596and have first and second pole tips 520 and 522 which are separated by awrite gap layer 524 at the ABS. The sensor 574 is located between firstand second gap layers 576 and 578 and the gap layers are located betweenfirst and second shield layers 580 and 582. The head 500 is mounted on aslider 542. A wear layer 528 may be employed for protecting thesensitive elements of the magnetic head and encapsulating the read andwrite head structure.

In FIG. 5, the second pole piece layer 594 has a pole tip region and ayoke region, the merging of these components being defined by a flarepoint 530 which is the location where the second pole piece layer 522begins to widen as it recesses in the head 500. The second pole tipregion extends from the ABS to the flare point 530, and the yoke regionextends from the flare point 530 to the backgap 596. It should be notedthat the merged head 500, as shown in FIG. 5, employs a single layer toserve a double function as a second shield layer 582 for the read headand as a first pole piece 592 for the write head. A piggyback heademploys two separate layers for these functions.

FIG. 6 is a partial ABS view of the slider 600 taken along plane 6-6 ofFIG. 5 to show the read and write elements of the prior art magnetichead. The sensor 674 is located between first and second gap layers 676and 678 and the gap layers are located between first and second shieldlayers 680 and 682. Again, a single layer may serve a double function asa second shield layer 682 for the read head and as a first pole piece692 for the write head. This single layer can be separated into aseparate read head and write head layer. The second pole tip 620 is overthe write gap layer 624

In response to external magnetic fields, the resistance of the sensor674 changes. A sense current I_(s) conducted through the sensor causesthese resistance changes to be manifested as potential changes. Thesepotential changes are then processed as readback signals by theprocessing circuitry 250 shown in FIG. 2.

FIG. 7 is a view 700 taken along plane 7-7 of FIG. 5 with all materialabove the second pole piece removed. In FIG. 7, a coil 784 is shown. Thecoil is connected to leads 720, 722. The second pole piece 794 extendsover the coil 784 at a pole tip 730. A wear layer 728 protects thesensitive elements of the magnetic head.

FIGS. 8 a-8 i illustrates the process of forming an aligned coil for aninductive head structure using a patterned seed layer according to thepresent invention. As yoke lengths in magnetic read/write heads shrinkto several microns, one must fabricate increasingly narrower write coilswith smaller pitch.

In FIG. 8 a, a magnetic material 810, for example, NiFe, is disposedabove a substrate 812 or read head structure 811. The magnetic material810 may form, for example, a first pole in an inductive head. FIG. 8 bshows an insulation layer 814 disposed over the magnetic material 810.The magnetic material 810 forming the pole may be covered with aRIE-able oxide, such as SiO₂. Optionally, an insulation layer (notshown) may also be disposed between the magnetic material 810 and thesubstrate 812.

In FIG. 8 c, a patterned seed layer material 820 is disposed over themagnetic material 810 and insulation layer 814. The seed layer 820 mayinclude, for example, a copper tungsten formation (Cu/W) or acopper-silicon-carbon formation (Cu/Si/C). The seed layer 820 may alsobe covered with a protective material capable of being etched byreactive ion etching (e.g. crosslinked photoresist). Next, as shown inFIG. 8 d, a hard bake resist 822 is formed over the seed layer 820.

According to the present invention, an aligned process is used where thebase plate imprint 820 is fabricated on an electrically insulating layer814. The reverse image of the coil structure is fabricated and etchedinto the coil insulation material, e.g., hard bake photoresist. This isshown in FIG. 8 d, which shows a hard mask layer 830 formed over thehard bake resist 822.

In an alternate embodiment, FIG. 8 e shows the formation of a resist pad832 which covers the transfer layer 822 and, possibly, the hard masklayer 830. The exposure of other area of the hard mask level 831 createsthe opportunity to electroplate a different material (e.g. NiFe) 837that is coplanar with the electroplated coil. As shown in FIG. 8 f, thisseparate plating step may include a non-magnetic layer 840. Upon removalof the patterned resist layer 832, one can etch through a patterenedhard mask layer 830 and create openings 850 which expose the patternedseed layer 820 at the bottom of said trenches 850.

FIG. 8 g shows the covering 852 of the pole tip and the deposition of anelectroplatable metal 860, for example copper, in the trenches 850. Theelectroplatable metal 860 is plated-up in the trenches 850 using anelectroplating bath. In a preferred embodiment, the coil structure 860that is plated up has the coil insulation in-situ where no post-platinginsulation fill process is required. The aspect ratio of the coils 860is limited by the reactive ion etching (RIE) process. The plated coilstructure 860 is plated in at least most of the thickness of the resist822 in method of creating the coils. Afterwards, the plated coils areplanarized to a somewhat smooth surface 859 which defines the top of theplated coils. After planarization, the top surface 859 will be below thehard mask 830 level location. This planarized surface is shown as adotted line in FIG. 8 g. An alternate method for creating the coils isto underplate the coils below thickness of the resist 822. The platedcoil structure 860 would subsequently be encapsulated by an insulator.An example of this would be an addition photoresist or patterninsulation layer 832. Inclusion of this layer is shown in FIG. 8 h.

In FIG. 8 h, a possible head with this coil structure is shown. Apatterned coil 860 where the top surface 859 was planarized would beelectrically isolated from a magnetic layer 868. This coil could also beelectrically isolated from an additional coil structure that isfabricated above the coil level shown. However, if additional coillevels are fabricated, only the turns of the coil would be electricallyisolated from adjacent turns.

While the method according to the present invention will require twocritical photo steps where the relative overlay error 862, as shown inFIG. 8 i, could not be greater than 50% of the width separating of thecopper coils, such precision is already required when aligning the poletip over the read sensor. This limitation will scale with a decrease incoil dimensions. Ideally, the pitch of the coils would be less than 1.0μm and a separation of 0.3 μm, so the allowable misalignment would beless 0.15 μm.

Accordingly, the method of coil fabrication according to the presentinvention requires no seed layer removal. The present invention thusalleviates the problems associated with complete ion removal of the seedlayer between high aspect ratio coils. Also, the present invention isnot prone to plating non-uniformities (voids), and is subject to seedlayer undercutting in a wet etch step process. This last point may beeven more uncontrollable as the coil aspect ratios increase.

The present invention provides the advantages that the coil layer andpole tip can be defined using thin resist lithography on a primarilyplanar surface, a magnetic write pole tip can be defined coplanar withthe coils, and no aspect ratio depleting seed layer removal step isrequired.

There are several details of the patterned seed layer as illustrated inFIGS. 9 a-9 c. This includes details within the area of the head, thearea between sliders on the wafer or the kerf, and the electroplatablecontact pads on the edge of the wafer.

Referring to FIGS. 9 a-9 b, first, the copper containing seed layermakes multiple turns of a coil 916, including last turn 929, where thecenter tap 933 will be the location where the coil circuit will becompleted at a different time in the process. The coil 916 is shown inrelation to the future ABS plane 936. In FIG. 9 b, the magnetic pedestal939 is shown. There will also be a via for magnetic backgap 931.

Now referring to FIG. 9 c, the last turn of the coil 929 extends to andbeyond via pads. Beyond the via pads 920, the seed layer is inelectrical contact with other patterned seed layer structures fromadjacent heads. The interconnection of coil shaped seed layer structuresalso allows all coils to be plated in the same process step.

Having all the interconnections of the kerf 910 allows a subsequentfield etch step to remove all the unwanted plated copper along with theseed layer in the kerf. This removal electrically isolates each coppercoil structure on the wafer. If the unwanted material is not removed,the location of copper in the kerf allows the material to be physicallyremoved during slider fab. The final slider product would have seedlayer portion exposed at the edge of the slider 933. This would be adiscoverable artifact that the patterned seed layer was used.

The ferromagnetic elements will be done after the coils are plated. Thefabrication of the ferromagnetic elements, which generally are made byelectroplating, demands the opening for the backgap, deposition ofmagnetic seed layer, resist patterning and finally plating and seedremoval. Because the coils are already plated and the space betweencopper coils is covered by the hard baked resist where there is noproblem with the magnetic seed layer causing inter-coil shorts. Afterthe magnetic plating the wafer is planarized via CMP. It can be excessplated magnetic material cover the hard baked resist of the coils (as inthe backgap region for example). This excess material will be removed inCMP step. This pole piece location would overlap the edge of the sliderthat will eventually become the ABS plane 936. This is shown in FIGS. 9a and 9 b.

FIG. 9 c shows a high aspect ratio seed layer matrix mask 900. Thepatterned mask 900 having a multi-turn coil 916 is fabricated as aplated seed layer mask. This patterned seed layer mask 900 could alsohave large probe pads 920 at the side of the wafer for a future headstructure contact. This solves the problem of seed removal in a coilstructure where the aspect ratio is large. FIG. 9 c shows the patternedseed layer mask 910 containing interconnected coils 930 that have anelectrical contact to a plating pad 927. This plating contact 927 islocated usually at the edge of the wafer 923.

FIG. 10 illustrates another embodiment 1000 according to the presentinvention wherein only the coil area 1010 is patterned and the remainingareas 1003 are full film. The remaining areas 1003 would be removedduring a seed layer step to electrically isolate the coil structures. Byusing two lithography steps to define the coils 1010, no seed removalstep is needed when high aspect ratio coils are produced

FIG. 11 is a flow chart 1100 of a process to incorporate an aligned coilstructure with a coplanar pole piece. This coil structure is formedabove magnetic material 1105, with the coil seed that is electricallyisolated from this material 1110. On this insulation layer, a patternedseed layer is deposited 1115. This layer includes conductive materialthat connects the seed to external plating contacts. Above the patternedseed, a hard bake resist layer is formed 1120. Above the hard bakeresist is a hard mask (e.g. SiO2) that is patterned via lithography stepand a RIE step to transfer the pattern into the hard bake 1125. Thistransfer will not only include the coil but also a pole piece 1130. Inorder to plate only the coils, the pole piece structures are selectivelyprotected under resist 1140. This will allow one to plate a coilstructure (e.g., with copper) 1145. One must remove the resistprotecting the pole piece structures 1150. In order to make a continuous(or near continuous) magnetic flux path between the magnetic layer belowthe coil and the pole piece, a magnetic layer is deposited across theentire wafer 1155. The magnetic pole piece along with the entire waferis plated in the same process step 1160. A planarization process isapplied to remove excess plated material and resist. This planarizationprocess will electrically isolate the coil structure from the magneticpole piece 1165. The remainder of the magnetic head would then befabricated 1180.

FIG. 12 is a flow chart 1200 of a process to incorporate an aligned coilstructure with a coplanar pole piece. The pole piece is created abovethis magnetic layer. First, a magnetic seed is deposited across thewafer 1210. Then a magnetic pole piece is patterned and plated. Thisstructure also includes the backgap portion of an inductive write head1215. Excess plated material and seed layer material is removed from thenon-device region 1220. An insulator material (e.g. alumina) isdeposited to electrically isolate the pole piece form subsequentprocessing 1225. A coil patterned seed layer is patterned and deposited1230. The wafer is then covered with a layer of resist which may be hardbaked 1235. A hard transfer mask (e.g. silica) is then deposited overthe resist and is patterned via RIE 1240. The image in the hard mask isthen transferred down through the resist via RIE 1245. The coils will beplated 1250. Ideally, the resist will be removed and replaced only overthe coils and the space between the coil and pole piece 1255. Excessplated and seed layer material in the field (outside the device region)would be removed 1260. The field will be filled with hard material (e.g.alumina) 1270. A planarization process is applied to remove excessplated and fill material, e.g., alumina. This planarization process willelectrically isolate the coil structure from the magnetic pole piece1275. The remainder of the head would then be fabricated 1280.

FIG. 13 is a flow chart 1300 of a process to incorporate an aligned coilstructure with a co-planar pole piece. This coil structure is formedabove a magnetic material 1305, with a coil seed layer which iselectrically isolated from this material 1310. On top of this insulatormaterial, the patterned seed layer would be patterned and deposited1315. The coil portion of the seed layer can be protected under resistso that the pole piece and backgap portion may be plated without platingover the coil region 1320. A magnetic seed layer would be deposited overthe resist and the filed of the wafer 1330. The pole piece and backgapwould be patterned and plated with magnetic material 1340. In order toplate the coil, the protection layer must be removed. This will includethe layer of magnetic seed material 1350. The coil would then bepatterned and plated 1360. In order to electrically isolate the deviceon the wafer, the excess material, both plated and seed layer, must beremoved from the non-device regions 1370. Replacing the material betweenthe coil and the pole piece with resist will prevent voids from formingand isolating the two materials 1375. The field is then filled with ahard insulating material (e.g. alumina) 1380. A planarization process isapplied to remove excess plated and fill material 1390. Thisplanarization will electrically isolate the coil structure from themagnetic pole piece. The remainder of the head would then be fabricated1395.

The foregoing description of the exemplary embodiment of the inventionhas been presented for the purposes of illustration and description. Itis not intended to be exhaustive or to limit the invention to theprecise form disclosed. Many modifications and variations are possiblein light of the above teaching. It is intended that the scope of theinvention be limited not with this detailed description, but rather bythe claims appended hereto.

1. An inductive head formed using an aligned coil for an inductive headstructure, comprising: an insulation layer provided over a magneticmaterial; a pre-patterned seed layer deposited over the insulationlayer; a hard bake resist layer formed to overlay the seed layer and theinsulation layer, wherein the hard bake resist layer forms at least onetrench; and an electroplatable metal formed in the trench to establish acoil, wherein the electroplatable metal is aligned with the seed layervia the trench.
 2. The inductive head of claim 1 further comprising acoil insulator deposited over the coil.
 3. The inductive head of claim 1wherein the hard bake resist layer is replaced with an oxide that isreadily etchable via reactive ion etching.
 4. The inductive head ofclaim 2 further comprising a magnetic material formed over the coilinsulator.
 5. The inductive head of claim 1 wherein the seed layer isfabricated as a plated seed layer mask, wherein the plated seed layermask includes large probe pads for plating contact.
 6. A magneticstorage device, comprising magnetic media for storing data thereon; amotor for translating the position of the magnetic media; an actuatorfor positioning a magnetic head relative to the magnetic media, themagnetic head including an inductive head formed using an aligned coilfor an inductive head structure, the inductive head further comprising:an insulation layer provided over a magnetic material; a pre-patternedseed layer deposited over the insulation layer; a hard bake resist layerformed to overlay the seed layer and the insulation layer, wherein thehard bake resist layer forms at least one trench; and an electroplatablemetal formed in the trench to establish a coil, wherein theelectroplatable metal is aligned with the seed layer via the trench. 7.The magnetic storage device of claim 6 further comprising a coilinsulator deposited over the coil.
 8. The magnetic storage device ofclaim 6 wherein the hard bake resist layer is replaced with an oxidethat is readily etchable via reactive ion etching.
 9. The magneticstorage device of claim 7 further comprising a second pole formed overthe coil insulator.
 10. The magnetic storage device of claim 6 whereinthe seed layer is fabricated as a plated seed layer mask, wherein theplated seed layer mask includes large probe pads for plating contact.